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Category:CPC F28D15/046
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Pages in category "CPC F28D15/046"
The following 27 pages are in this category, out of 27 total.
1
- 18345597. VARIABLE HEAT PIPE THICKNESS AND DIAMETER FOR DIRECT HEAT PIPE ATTACHMENT AND IMPROVED THERMAL MANAGEMENT (Intel Corporation)
- 18673662. VAPOR CHAMBER WITH MICROSTRUCTURE LAYER simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18737095. Thermally Conductive Structure and Manufacturing Method Thereof, Heat Sink, and Electronic Device Including Heat Sink simplified abstract (HUAWEI TECHNOLOGIES CO., LTD.)
- 18944213. WICK AND HEAT TRANSPORT DEVICE (Murata Manufacturing Co., Ltd.)
- 18973801. Vapor Chamber and Electronic Device (HUAWEI TECHNOLOGIES CO., LTD.)
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- Huawei technologies co., ltd. (20240318921). VAPOR CHAMBER WITH MICROSTRUCTURE LAYER simplified abstract
- Huawei technologies co., ltd. (20240318922). Thermally Conductive Structure and Manufacturing Method Thereof, Heat Sink, and Electronic Device Including Heat Sink simplified abstract
- Huawei technologies co., ltd. (20250102234). Vapor Chamber and Electronic Device
- Huawei Technologies Co., Ltd. Patent Application Trends in 2025
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on March 27th, 2025
- HUAWEI TECHNOLOGIES CO., LTD. patent applications on September 26th, 2024
