VAPOR CHAMBER WITH MICROSTRUCTURE LAYER

Organization Name

HUAWEI TECHNOLOGIES CO., LTD.

Inventor(s)

Xiaobang Liu of Wuhan (CN)

Jie Yang of Shenzhen (CN)

Hua Liu of Shenzhen (CN)

VAPOR CHAMBER WITH MICROSTRUCTURE LAYER - A simplified explanation of the abstract

This abstract first appeared for US patent application 18673662 titled 'VAPOR CHAMBER WITH MICROSTRUCTURE LAYER

Simplified Explanation:

This patent application describes a vapor chamber with a unique design to efficiently transfer heat. The chamber includes two plate covers forming a cavity, with capillary structures arranged inside. These structures support the plates and create a vapor channel filled with a working medium. A microstructure layer helps the liquid-phase working medium return in time in the condensation region.

Key Features and Innovation:

   - Vapor chamber design with capillary structures for heat transfer.
   - Microstructure layer for efficient working medium return.
   - Unique arrangement of components for optimal performance.

Potential Applications:

   - Electronics cooling systems.
   - Thermal management in computers and servers.
   - Heat dissipation in LED lighting.

Problems Solved:

   - Efficient heat transfer in confined spaces.
   - Preventing overheating in electronic devices.
   - Enhancing thermal performance in various applications.

Benefits:

   - Improved cooling efficiency.
   - Enhanced reliability of electronic components.
   - Increased lifespan of devices.

Commercial Applications:

   - "Innovative Vapor Chamber Design for Enhanced Heat Transfer in Electronics Cooling Systems"
   - Potential use in high-performance computing systems.
   - Market implications in the electronics cooling industry.

Prior Art:

   - Readers can explore prior patents related to vapor chambers, capillary structures, and heat transfer technologies.

Frequently Updated Research:

   - Stay updated on advancements in vapor chamber technology, heat transfer research, and thermal management solutions.

Questions about vapor chambers: 1. What are the key components of a vapor chamber and how do they contribute to heat transfer efficiency? 2. How does the microstructure layer in this vapor chamber design improve the performance of the working medium return process?

Original Abstract Submitted

A vapor chamber is provided. The vapor chamber includes a first and a second plate cover, and a capillary structure, where the first and the second plate cover form an accommodating cavity. Capillary structures are in a shape of a long strip, and are arranged at intervals in the accommodating cavity in parallel. Two opposite surfaces of the capillary structure are respectively connected to the first and the second plate cover, to support the first plate cover and the second plate cover in an overlapping direction of the first plate cover and the second plate cover. A vapor channel is formed around the capillary structure filled with a working medium. The microstructure layer is introduced to an inner surface of the accommodating cavity and the capillary structure in the vapor chamber. In the vapor chamber, the liquid-phase working medium in the condensation region can return in time.