Huawei technologies co., ltd. (20240318921). VAPOR CHAMBER WITH MICROSTRUCTURE LAYER simplified abstract
VAPOR CHAMBER WITH MICROSTRUCTURE LAYER
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VAPOR CHAMBER WITH MICROSTRUCTURE LAYER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240318921 titled 'VAPOR CHAMBER WITH MICROSTRUCTURE LAYER
Simplified Explanation:
This patent application describes a vapor chamber with a capillary structure that supports two plate covers and allows for the efficient movement of a working medium. The vapor chamber includes a microstructure layer to enhance performance.
- The vapor chamber consists of two plate covers and a capillary structure.
- The capillary structure is in the shape of a long strip and supports the plate covers.
- A vapor channel is formed around the capillary structure filled with a working medium.
- A microstructure layer is introduced to improve the performance of the vapor chamber.
- The design allows for the liquid-phase working medium to return in time in the condensation region.
Potential Applications:
This technology can be used in various cooling applications such as electronics, LED lighting, and high-performance computing where efficient heat dissipation is crucial.
Problems Solved:
This technology addresses the challenge of efficiently dissipating heat in confined spaces and maintaining optimal operating temperatures in electronic devices.
Benefits:
The vapor chamber design improves heat dissipation efficiency, reduces the risk of overheating in electronic devices, and enhances overall performance and reliability.
Commercial Applications:
Title: Advanced Cooling Solutions for Electronics and High-Performance Computing This technology can be commercialized for electronic devices, LED lighting systems, and high-performance computing servers to improve thermal management and extend the lifespan of components.
Prior Art:
Prior art related to this technology may include patents or research papers on vapor chambers, capillary structures for heat dissipation, and microstructure layers for enhancing thermal performance in electronic devices.
Frequently Updated Research:
Researchers are continually exploring new materials and designs to further enhance the efficiency and performance of vapor chambers in various applications.
Questions about Vapor Chamber Technology: 1. How does the capillary structure in the vapor chamber contribute to heat dissipation efficiency? 2. What are the potential challenges in implementing this technology in different electronic devices and cooling systems?
Original Abstract Submitted
a vapor chamber is provided. the vapor chamber includes a first and a second plate cover, and a capillary structure, where the first and the second plate cover form an accommodating cavity. capillary structures are in a shape of a long strip, and are arranged at intervals in the accommodating cavity in parallel. two opposite surfaces of the capillary structure are respectively connected to the first and the second plate cover, to support the first plate cover and the second plate cover in an overlapping direction of the first plate cover and the second plate cover. a vapor channel is formed around the capillary structure filled with a working medium. the microstructure layer is introduced to an inner surface of the accommodating cavity and the capillary structure in the vapor chamber. in the vapor chamber, the liquid-phase working medium in the condensation region can return in time.