There is currently no text in this page. You can search for this page title in other pages, or search the related logs, but you do not have permission to create this page.
Category:C23C16/44
Jump to navigation
Jump to search
Subcategories
This category has the following 42 subcategories, out of 42 total.
A
C
H
J
K
M
N
Q
R
S
T
Y
Pages in category "C23C16/44"
The following 186 pages are in this category, out of 186 total.
1
- 17878622. SUBSTRATE PROCESSING SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17908798. SEMICONDUCTOR MANUFACTURING APPARATUS AND CLEANING METHOD OF SEMICONDUCTOR MANUFACTURING APPARATUS simplified abstract (Hitachi High-Tech Corporation)
- 17946947. BACKSIDE DEPOSITION FOR WAFER BOW MANAGEMENT simplified abstract (Applied Materials, Inc.)
- 17955785. DOG BONE EXHAUST SLIT TUNNEL FOR PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
- 17961553. HALOGEN-RESISTANT THERMAL BARRIER COATING FOR PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
- 17961601. SUBSTRATE PROCESSING APPARATUS AND CONTROL METHOD FOR A SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 17962310. HALOGEN-RESISTANT THERMAL BARRIER COATING FOR PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
- 17962378. ATOMIC LAYER DEPOSITION COATING SYSTEM FOR INNER WALLS OF GAS LINES simplified abstract (Applied Materials, Inc.)
- 18070010. GAS RECYCLING SYSTEMS, SUBSTRATE PROCESSING SYSTEMS, AND RELATED APPARATUS AND METHODS FOR SEMICONDUCTOR MANUFACTURING simplified abstract (Applied Materials, Inc.)
- 18093681. CLEANING OPERATIONS BASED ON DEPOSITION THICKNESS simplified abstract (Applied Materials, Inc.)
- 18100326. ADJUSTABLE CROSS-FLOW PROCESS CHAMBER LID simplified abstract (Applied Materials, Inc.)
- 18118499. PRECURSOR DELIVERY SYSTEM FOR SEMICONDUCTOR DEVICE FORMATION simplified abstract (Applied Materials, Inc.)
- 18131212. HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION simplified abstract (Applied Materials, Inc.)
- 18136070. EDGE RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18181077. SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES simplified abstract (Applied Materials, Inc.)
- 18215454. SUBSTRATE PROCESSING APPARATUS AND EXHAUST METHOD THEREOF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18226854. SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Kokusai Electric Corporation)
- 18255407. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (TOKYO ELECTRON LIMITED)
- 18337281. METHOD OF DEPOSITION IN HIGH ASPECT RATIO (HAR) FEATURES (Tokyo Electron Limited)
- 18354220. SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18357293. METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18397372. SHAFT MEMBERS, PROCESS KITS AND SEMICONDUCTOR PROCESSING SYSTEMS HAVING SHAFT MEMBERS, AND METHODS OF MAKING SEMICONDUCTOR PROCESSING SYSTEMS simplified abstract (ASM IP Holding B.V.)
- 18419021. GAS SUPPLY SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18425048. DEPOSITION SYSTEM AND PROCESSING SYSTEM simplified abstract (Samsung Electronics Co., Ltd.)
- 18451862. FILM FORMING METHOD AND ATMOSPHERIC PLASMA FILM FORMING APPARATUS simplified abstract (FUJIFILM Corporation)
- 18479214. APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE USING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18495224. WAFER PROCESSING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18508704. PROCESS CHAMBER CLEANING APPARATUS AND METHOD simplified abstract (Samsung Electronics Co., Ltd.)
- 18513448. SEALING ARTICLE COMPRISING METAL COATING, METHOD OF MAKING AND METHOD OF USING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18513994. PROCESSING APPARATUS AND PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18518393. SYSTEMS AND METHODS FOR CONTROLLING PRESSURE IN SUBSTRATE PROCESSING SYSTEMS simplified abstract (ASM IP Holding B.V.)
- 18522132. EQUIPMENT FRONT-END MODULES FOR SEMICONDUCTOR PROCESSING SYSTEMS AND METHODS OF MAKING SEMICONDUCTOR PROCESSING SYSTEMS simplified abstract (ASM IP Holding B.V.)
- 18522825. PRECOAT METHOD FOR SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18523021. HIGH-THROUGHPUT SILICON CARBIDE REACTOR simplified abstract (ASM IP Holding B.V.)
- 18523060. SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD simplified abstract (Tokyo Electron Limited)
- 18523394. SINGLE WAFER PROCESSING ENVIRONMENTS WITH SPATIAL SEPARATION simplified abstract (Applied Materials, Inc.)
- 18525207. VAPORIZER, PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Kokusai Electric Corporation)
- 18526472. SUBSTRATE PROCESSING APPARATUS, PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18557675. PROCESSING SYSTEM AND METHODS FOR FORMING VOID-FREE AND SEAM-FREE TUNGSTEN FEATURES simplified abstract (Applied Materials, Inc.)
- 18558388. METHODS TO IMPROVE PRODUCTIVITY OF ADVANCED CVD W GAPFILL PROCESS simplified abstract (Applied Materials, Inc.)
- 18581154. SYSTEM AND METHOD FOR BACKSIDE DEPOSITION OF A SUBSTRATE simplified abstract (Tokyo Electron Limited)
- 18592646. SUBSTRATE PROCESSING APPARATUS, CLEANING METHOD, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18602099. CHAMBER ARCHITECTURE FOR EPITAXIAL DEPOSITION AND ADVANCED EPITAXIAL FILM APPLICATIONS simplified abstract (Applied Materials, Inc.)
- 18605574. TREATMENT SOLUTION AND TREATMENT METHOD simplified abstract (KABUSHIKI KAISHA TOSHIBA)
- 18605574. TREATMENT SOLUTION AND TREATMENT METHOD simplified abstract (TOHOKU UNIVERSITY)
- 18611936. SUBSTRATE PROCESSING DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18612197. Additive Manufacturing Powder, Method For Producing Additive Manufacturing Powder, And Additively Manufactured Body simplified abstract (SEIKO EPSON CORPORATION)
- 18624402. FILM FORMING APPARATUS AND FILM FORMING METHOD simplified abstract (Tokyo Electron Limited)
- 18626047. SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR CLEANING THE SAME simplified abstract (Applied Materials, Inc.)
- 18627313. APPARATUS AND METHODS FOR EXHAUST CLEANING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18649004. METAL COMPONENTS WITH INERT VAPOR PHASE COATING ON INTERNAL SURFACES simplified abstract (AGILENT TECHNOLOGIES, INC.)
- 18649035. METAL COMPONENTS WITH INERT VAPOR PHASE COATING ON INTERNAL SURFACES simplified abstract (AGILENT TECHNOLOGIES, INC.)
- 18649171. METAL COMPONENTS WITH INERT VAPOR PHASE COATING ON INTERNAL SURFACES simplified abstract (AGILENT TECHNOLOGIES, INC.)
- 18649199. METAL COMPONENTS WITH INERT VAPOR PHASE COATING ON INTERNAL SURFACES simplified abstract (AGILENT TECHNOLOGIES, INC.)
- 18649231. METAL COMPONENTS WITH INERT VAPOR PHASE COATING ON INTERNAL SURFACES simplified abstract (AGILENT TECHNOLOGIES, INC.)
- 18649268. METAL COMPONENTS WITH INERT VAPOR PHASE COATING ON INTERNAL SURFACES simplified abstract (AGILENT TECHNOLOGIES, INC.)
- 18649302. METAL COMPONENTS WITH INERT VAPOR PHASE COATING ON INTERNAL SURFACES simplified abstract (AGILENT TECHNOLOGIES, INC.)
- 18666251. REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING simplified abstract (Applied Materials, Inc.)
- 18669753. SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18673669. EXHAUST SYSTEM WITH U-SHAPED PIPES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18705428. ATOMIC LAYER DEPOSITION SEAM REDUCTION (Lam Research Corporation)
- 18732080. SYSTEM AND METHOD OF CLEANING PROCESS CHAMBER COMPONENTS simplified abstract (Applied Materials, Inc.)
- 18733504. MULTI-THERMAL CVD CHAMBERS WITH SHARED GAS DELIVERY AND EXHAUST SYSTEM simplified abstract (Applied Materials, Inc.)
- 18747687. GAS INJECTOR FOR EPITAXY AND CVD CHAMBER simplified abstract (Applied Materials, Inc.)
- 18773920. SYSTEM AND METHOD FOR RECLAIMING TUNGSTEN COMPOUNDS (Micron Technology, Inc.)
- 18779226. APPARATUS FOR TREATING SUBSTRATE (SAMSUNG ELECTRONICS CO., LTD.)
- 18808746. MULTI-STAGE PUMPING LINER (Applied Materials, Inc.)
- 18813502. PROCESS FOR MANUFACTURING A SILICON CARBIDE COATED BODY (Applied Materials, Inc.)
- 18819583. REACTION CHAMBER WITH STOP-GAPPED VACUUM SEAL (CANON KABUSHIKI KAISHA)
- 18884515. SUBSTRATE PROCESSING APPARATUS WITH FLOW CONTROL RING AND METHOD OF USING SAME (ASM IP Holding B.V.)
- 18884897. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM (Kokusai Electric Corporation)
- 18891526. SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS (Kokusai Electric Corporation)
- 18891772. SUBSTRATE PROCESSING APPARATUS, PROCESSING VESSEL, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (Kokusai Electric Corporation)
- 18894881. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM (Kokusai Electric Corporation)
- 18895787. SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS (Kokusai Electric Corporation)
- 18947353. SEAL STRUCTURE, CHAMBER, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF INSTALLING SEAL MATERIAL (Tokyo Electron Limited)
- 18961055. GAS TRANSPORT SYSTEM (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18967876. GAS-PHASE REACTOR SYSTEM INCLUDING A GAS DETECTOR (ASM IP Holding B.V.)
- 18973637. FILM FORMING APPARATUS (Tokyo Electron Limited)
- 18975622. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (Kokusai Electric Corporation)
2
- 20240011153. CONTINUOUS LINER FOR USE IN A PROCESSING CHAMBER simplified abstract (Applied Materials, Inc.)
- 20240011156. DEPOSITION APPARATUS simplified abstract (Samsung Display Co., Ltd.)
- 20240018648. Purge Ring for Reduced Substrate Backside Deposition simplified abstract (APPLIED MATERIALS, INC.)
- 20240018649. Powder-Surface Treatment Apparatus simplified abstract (Hyundai Motor Company)
- 20240021444. BATCH PROCESSING APPARATUS, SYSTEMS, AND RELATED METHODS AND STRUCTURES FOR EPITAXIAL DEPOSITION OPERATIONS simplified abstract (APPLIED MATERIALS, INC.)
- 20240047185. SHARED RPS CLEAN AND BYPASS DELIVERY ARCHITECTURE simplified abstract (Applied Materials, Inc.)
3
A
- Applied materials, inc. (20240247371). SEMICONDUCTOR PROCESSING CHAMBERS AND METHODS FOR CLEANING THE SAME simplified abstract
- Applied materials, inc. (20240247373). ADJUSTABLE CROSS-FLOW PROCESS CHAMBER LID simplified abstract
- Applied materials, inc. (20240247374). PRECURSOR DELIVERY SYSTEM FOR SEMICONDUCTOR DEVICE FORMATION simplified abstract
- Applied materials, inc. (20240254655). EPI ISOLATION PLATE AND PARALLEL BLOCK PURGE FLOW TUNING FOR GROWTH RATE AND UNIFORMITY simplified abstract
- Applied materials, inc. (20240266206). LIFT PIN ASSEMBLY simplified abstract
- Applied materials, inc. (20240304423). SEMICONDUCTOR CHAMBER COMPONENTS WITH ADVANCED COATING TECHNIQUES simplified abstract
- Applied materials, inc. (20240304430). REAL-TIME DETECTION OF PARTICULATE MATTER DURING DEPOSITION CHAMBER MANUFACTURING simplified abstract
- Applied materials, inc. (20240337020). GAS INJECTOR FOR EPITAXY AND CVD CHAMBER simplified abstract
- Applied materials, inc. (20240337318). HIGH TEMPERATURE METAL SEALS FOR VACUUM SEGREGATION simplified abstract
- Applied materials, inc. (20240417266). PROCESS FOR MANUFACTURING A SILICON CARBIDE COATED BODY
- Applied materials, inc. (20250003076). MODULAR HEATING JACKET WITH REMOLDABLE INSULATOR
- Applied materials, inc. (20250087471). MULTI-STAGE PUMPING LINER
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on August 8th, 2024
- Applied Materials, Inc. patent applications on December 19th, 2024
- Applied Materials, Inc. patent applications on February 13th, 2025
- Applied Materials, Inc. patent applications on January 23rd, 2025
- Applied Materials, Inc. patent applications on January 2nd, 2025
- Applied Materials, Inc. patent applications on January 30th, 2025
- Applied Materials, Inc. patent applications on July 25th, 2024
- Applied Materials, Inc. patent applications on March 13th, 2025
- Applied Materials, Inc. patent applications on October 10th, 2024
- Applied Materials, Inc. patent applications on September 12th, 2024
B
- Blockchain patent applications on 22nd Mar 2024
- Blockchain patent applications on April 11th, 2024
- Blockchain patent applications on April 4th, 2024
- Blockchain patent applications on February 8th, 2024
- Blockchain patent applications on January 11th, 2024
- Blockchain patent applications on January 18th, 2024
- Blockchain patent applications on March 21st, 2024
C
- Canon kabushiki kaisha (20240419090). REACTION CHAMBER WITH STOP-GAPPED VACUUM SEAL
- CANON KABUSHIKI KAISHA patent applications on December 19th, 2024
- Contemporary amperex technology co., limited (20240258584). PROTECTION METHOD AND DEVICE FOR SECONDARY BATTERY, SECONDARY BATTERY, BATTERY MODULE, BATTERY PACK, AND ELECTRIC APPARATUS simplified abstract
- CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED patent applications on August 1st, 2024
K
M
S
- SAFRAN CERAMICS (20240254622). ADDITIVE MANUFACTURING PROCESS FOR PRODUCING A STRUCTURE simplified abstract
- Samsung display co., ltd. (20240218513). APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING SUBSTRATE USING THE SAME simplified abstract
- Samsung display co., ltd. (20240274625). METHOD AND APPARATUS FOR MANUFACTURING DISPLAY DEVICE simplified abstract
- SAMSUNG DISPLAY CO., LTD. patent applications on August 15th, 2024
- Samsung Display Co., LTD. patent applications on July 4th, 2024
- Samsung electronics co., ltd. (20240093368). EDGE RING, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME, AND SUBSTRATE PROCESSING METHOD USING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240209495). DEPOSITION SYSTEM AND PROCESSING SYSTEM simplified abstract
- Samsung electronics co., ltd. (20240234177). WAFER PROCESSING APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240279802). PROCESS CHAMBER CLEANING APPARATUS AND METHOD simplified abstract
- Samsung electronics co., ltd. (20240279808). GAS SUPPLY SYSTEM simplified abstract
- Samsung electronics co., ltd. (20240287668). DLC FILM DEPOSITION APPARATUS, SEMICONDUCTOR MANUFACTURING SYSTEM INCLUDING THE DLC FILM DEPOSITION APPARATUS, AND SEMICONDUCOR MANUFACTURING METHOD USING THE DLC FILM DEPOSITION APPARATUS simplified abstract
- Samsung electronics co., ltd. (20240318307). SUBSTRATE PROCESSING DEVICE simplified abstract
- Samsung electronics co., ltd. (20250092522). SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME
- Samsung electronics co., ltd. (20250101582). APPARATUS FOR TREATING SUBSTRATE
- Samsung Electronics Co., Ltd. patent applications on August 22nd, 2024
- Samsung Electronics Co., Ltd. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 29th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on July 11th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 21st, 2024
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- SEIKO EPSON CORPORATION (20240316630). Additive Manufacturing Powder, Method For Producing Additive Manufacturing Powder, And Additively Manufactured Body simplified abstract
- Seiko epson corporation (20240316630). Additive Manufacturing Powder, Method For Producing Additive Manufacturing Powder, And Additively Manufactured Body simplified abstract
- Seiko epson corporation (20250003063). Particle Coating Apparatus And Method Of Coating Particle
- Seiko epson corporation (20250003064). Particle Coating Apparatus And Method Of Coating Particle
- SEIKO EPSON CORPORATION patent applications on January 2nd, 2025
- SEIKO EPSON CORPORATION patent applications on September 26th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240246124). APPARATUS AND METHODS FOR EXHAUST CLEANING simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240310741). EXHAUST SYSTEM WITH U-SHAPED PIPES simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250092892). GAS TRANSPORT SYSTEM
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 25th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240102162). MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240258123). GAS FLOW ACCELERATOR TO PREVENT BUILDUP OF PROCESSING BYPRODUCT IN A MAIN PUMPING LINE OF A SEMICONDUCTOR PROCESSING TOOL simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 1st, 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Tokyo electron limited (20240295022). PROCESSING METHOD AND PROCESSING APPARATUS simplified abstract
- Tokyo electron limited (20240295023). SUBSTRATE PROCESSING APPARATUS simplified abstract
- Tokyo electron limited (20240337022). FILM FORMING APPARATUS AND FILM FORMING METHOD simplified abstract
- Tokyo Electron Limited patent applications on March 6th, 2025
- Tokyo Electron Limited patent applications on October 10th, 2024
- Tokyo Electron Limited patent applications on September 5th, 2024
U
- US Patent Application 18231165. DEVICE FOR ADJUSTING POSITION OF CHAMBER AND PLASMA PROCESS CHAMBER INCLUDING THE SAME FOR SEMICONDUCTOR MANUFACTURING simplified abstract
- US Patent Application 18232421. MOLYBDENUM(0) PRECURSORS FOR DEPOSITION OF MOLYBDENUM FILMS simplified abstract
- US Patent Application 18249552. PLASMA PROCESSING APPARATUS simplified abstract
- US Patent Application 18324192. MANUFACTURING METHOD OF DISPLAY DEVICE AND CVD DEVICE simplified abstract
- US Patent Application 18324469. SUBSTRATE PROCESSING APPARATUS simplified abstract
- US Patent Application 18362760. SEMICONDUCTOR PROCESS CHAMBER CONTAMINATION PREVENTION SYSTEM simplified abstract
