US Patent Application 18324469. SUBSTRATE PROCESSING APPARATUS simplified abstract

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SUBSTRATE PROCESSING APPARATUS

Organization Name

Tokyo Electron Limited

Inventor(s)

Naoki Umehara of Nirasaki City (JP)

Syuji Nozawa of Nirasaki City (JP)

Ryohei Yoneda of Nirasaki City (JP)

Tatsuya Yamaguchi of Nirasaki City (JP)

SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18324469 titled 'SUBSTRATE PROCESSING APPARATUS

Simplified Explanation

The patent application describes a substrate processing apparatus that is used to process substrates in a controlled environment.

  • The apparatus includes a processing container where the substrate is placed on a stage.
  • An exhaust port is arranged around the stage to remove any gases or particles generated during the processing.
  • The stage can be moved up and down between a processing position and a transfer position.
  • A clamp ring is used to cover the peripheral edge of the substrate when it is in the processing position.
  • The clamp ring is supported by a shelf on the sidewall of the processing container when the stage is in the transfer position.
  • A pressure regulating mechanism is included to maintain a balanced pressure between the space above the substrate and the space below the stage.


Original Abstract Submitted

A substrate processing apparatus includes: a processing container; a stage provided inside the processing container to place a substrate thereon; an exhaust port arranged around the stage along an inner wall of the processing container; a driver configured to move the stage up and down between a processing position and a transfer position lower than the processing position; a clamp ring that is arranged on a peripheral edge of the substrate on the stage to cover the peripheral edge of the substrate when the stage is at the processing position, and is supported by a shelf provided on a sidewall of the processing container when the stage is at the transfer position; and a pressure regulating mechanism configured to suppress a pressure difference between a space above the substrate on the stage and a space below the stage.

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