Category:Shin-Puu Jeng of Hsinchu (TW)
Shin-Puu Jeng
Shin-Puu Jeng from Hsinchu (TW) has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L23/28 with taiwan semiconductor manufacturing co., ltd..
Patents
Pages in category "Shin-Puu Jeng of Hsinchu (TW)"
The following 70 pages are in this category, out of 70 total.
1
- 17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17654907. Dicing Process in Packages Comprising Organic Interposers simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17663683. Semiconductor Package and Method simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17698611. Semiconductor Packages with Thermal Lid and Methods of Forming the Same simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17746822. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17806311. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17840362. Molding Structures for Integrated Circuit Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18403686. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18409620. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18443338. SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18454084. INTEGRATED CIRCUIT AND SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18502307. SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18506739. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18510646. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18515264. SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517232. PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18517489. Stacking Via Structures for Stress Reduction simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18518466. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18599734. EMBEDDED STRESS ABSORBER IN PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18604613. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624686. PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18624903. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18647106. Heterogeneous Antenna in Fan-Out Package simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18664508. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668687. CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18668922. BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18674891. SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18674930. MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18941292. PACKAGE STRUCTURE (Taiwan Semiconductor Manufacturing Company, LTD.)
- 18958845. SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING AND METHOD OF MANUFACTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
T
- Taiwan semiconductor manufacturing co., ltd. (20240194556). SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240222247). SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240249994). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240250069). PACKAGE STRUCTURE CONTAINING CHIP STRUCTURE WITH INCLINED SIDEWALLS simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312852). MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312887). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250087588). INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Taiwan semiconductor manufacturing co., ltd. (20250087598). SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING AND METHOD OF MANUFACTURE
- Taiwan semiconductor manufacturing company, ltd. (20240105705). Fan-Out Package with Cavity Substrate simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240136246). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240178116). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240213213). EMBEDDED STRESS ABSORBER IN PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290682). PACKAGE STRUCTURE WITH BUFFER LAYER EMBEDDED IN LID LAYER simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240290755). SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297432). Heterogeneous Antenna in Fan-Out Package simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304533). BUMP JOINT STRUCTURE WITH DISTORTION AND METHOD FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304559). CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240304572). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379494). HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379577). CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379646). SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379648). Semiconductor Devices and Methods of Manufacturing simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240413028). DIE STRUCTURES AND METHODS OF FORMING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250062245). SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Taiwan semiconductor manufacturing company, ltd. (20250070046). INTEGRATED CIRCUIT AND SEMICONDUCTOR DEVICE
- Taiwan semiconductor manufacturing company, ltd. (20250070050). PACKAGE STRUCTURE
U
- US Patent Application 17663793. SEMICONDUCTOR PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME simplified abstract
- US Patent Application 17664538. SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING simplified abstract
- US Patent Application 17664689. INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME simplified abstract
- US Patent Application 17828691. Package and Method for Forming the Same simplified abstract
- US Patent Application 18346319. Integrated Circuit Package and Method Forming Same simplified abstract
- US Patent Application 18353901. PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME simplified abstract
- US Patent Application 18358491. SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE simplified abstract
- US Patent Application 18360484. HIGH EFFICIENCY HEAT DISSIPATION USING DISCRETE THERMAL INTERFACE MATERIAL FILMS simplified abstract
- US Patent Application 18361933. METALLIZATION STRUCTURE simplified abstract
- US Patent Application 18446291. Semiconductor Devices and Methods of Manufacturing simplified abstract
- US Patent Application 18447443. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING simplified abstract
- US Patent Application 18447769. DUAL-SIDED ROUTING IN 3D SIP STRUCTURE simplified abstract