Category:JIAN-YU SHIH

JIAN-YU SHIH

Executive Summary

JIAN-YU SHIH is an inventor who has filed 3 patents. Their primary areas of innovation include based on aluminium nitride (1 patents), {obtaining ceramic films, e.g. by using temporary supports} (1 patents), {Milling} (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

Technology Areas

Error creating thumbnail: File missing

List of Technology Areas

• C04B35/581 (based on aluminium nitride): 1 patents
• C04B35/62218 ({obtaining ceramic films, e.g. by using temporary supports}): 1 patents
• C04B35/6261 ({Milling}): 1 patents
• C04B35/638 (Removal thereof): 1 patents
• C04B35/64 (Burning or sintering processes (): 1 patents
• C04B2235/3225 (Yttrium oxide or oxide-forming salts thereof): 1 patents
• C04B2235/386 (Boron nitrides): 1 patents
• C04B2235/3865 (Aluminium nitrides): 1 patents
• C04B2235/528 (Spheres): 1 patents
• C04B2235/5292 (Flakes, platelets or plates): 1 patents
• C04B2235/5436 (micrometer sized, i.e. from 1 to 100 micron): 1 patents
• C04B2235/5445 (submicron sized, i.e. from 0,1 to 1 micron): 1 patents
• C04B2235/5454 (nanometer sized, i.e. below 100 nm): 1 patents
• C04B2235/6025 (Tape casting, e.g. with a doctor blade): 1 patents
• C04B2235/604 (Pressing at temperatures other than sintering temperatures): 1 patents
• C04B2235/612 (Machining): 1 patents
• C04B2235/6581 (Total pressure below 1 atmosphere, e.g. vacuum): 1 patents
• C04B2235/667 (Sintering using wave energy, e.g. microwave sintering): 1 patents
• C04B2235/668 (Pressureless sintering): 1 patents
• C04B2235/78 (Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures): 1 patents
• H05K3/12 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
• H05K1/18 (Printed circuits structurally associated with non-printed electric components ({): 1 patents
• H05K2201/10984 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H10H20/857 (No explanation available): 1 patents
• H10H20/853 (No explanation available): 1 patents
• H10H20/0362 (No explanation available): 1 patents
• H10H20/0364 (No explanation available): 1 patents

Companies

Error creating thumbnail: File missing

List of Companies

• TONG HSING ELECTRONIC INDUSTRIES, LTD.: 3 patents

Collaborators

• SHIH-HAN WU (3 collaborations)
• JHIH-WEI LAI (3 collaborations)
• MING-YEN PAN (2 collaborations)
• KAI-MOU CHOU (1 collaborations)
• YU-HSIEN LIAO (1 collaborations)
• HAO-EN HUNG (1 collaborations)