Pages that link to "Category:Aleksandar Aleksov of Chandler AZ (US)"
The following pages link to Category:Aleksandar Aleksov of Chandler AZ (US):
Displaying 22 items.
- Patent Applications Report for 31st Mar 2023 (← links)
- Intel corporation (20240113005). HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract (← links)
- 17957751. HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STRUCTURES simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240162157). BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract (← links)
- 17988051. BUMPLESS HYBRID ORGANIC GLASS INTERPOSER simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240178162). INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract (← links)
- 18060125. INTEGRATED CIRCUIT PACKAGES INCLUDING A GLASS CORE WITH A FILTER STRUCTURE simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240222018). SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract (← links)
- 18147503. SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240266745). MICROELECTRONIC DEVICES DESIGNED WITH MOLD PATTERNING TO CREATE PACKAGE-LEVEL COMPONENTS FOR HIGH FREQUENCY COMMUNICATION SYSTEMS simplified abstract (← links)
- Intel corporation (20240274576). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract (← links)
- Intel corporation (20240339410). DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract (← links)
- 18746188. DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation) (← links)
- Intel corporation (20240355768). MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS simplified abstract (← links)
- Intel corporation (20240429173). MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME (← links)
- 18344695. CARBON NANOFIBER CAPACITOR APPARATUS AND RELATED METHODS (Intel Corporation) (← links)
- Intel corporation (20250069902). INTEGRATED CIRCUIT PACKAGE SUPPORTS (← links)
- Intel corporation (20250070083). MICROELECTRONIC ASSEMBLIES (← links)
- Intel corporation (20250079300). MAGNETIC INDUCTORS FOR SEMICONDUCTOR PACKAGING (← links)
- 18945842. INTEGRATED CIRCUIT PACKAGE SUPPORTS (Intel Corporation) (← links)
- 18942054. MICROELECTRONIC ASSEMBLIES (Intel Corporation) (← links)
- Category:Srinivas V. Pietambaram of Chandler AZ (US) (← links)