18945842. INTEGRATED CIRCUIT PACKAGE SUPPORTS (Intel Corporation)
INTEGRATED CIRCUIT PACKAGE SUPPORTS
Organization Name
Inventor(s)
Kristof Kuwawi Darmawikarta of Chandler AZ (US)
Robert May of Chandler AZ (US)
Sri Ranga Sai Boyapati of Austin TX (US)
Srinivas V. Pietambaram of Chandler AZ (US)
Chung Kwang Christopher Tan of Portland OR (US)
Aleksandar Aleksov of Chandler AZ (US)
INTEGRATED CIRCUIT PACKAGE SUPPORTS
This abstract first appeared for US patent application 18945842 titled 'INTEGRATED CIRCUIT PACKAGE SUPPORTS
Original Abstract Submitted
Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, a method for forming an IC package support may include forming a first dielectric material having a surface; forming a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees relative to the surface of the first dielectric material; forming a second dielectric material, having a surface, on the first dielectric material; and forming a second conductive via in the second dielectric material, wherein the second conductive via is electrically coupled to the first conductive via, has tapered sidewalls with an angle that is greater than 80 degrees relative to the surface of the second dielectric material, and a maximum diameter between 2 microns and 20 microns.