SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL CHARACTERISTICS

Organization Name

Inventor(s)

SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL CHARACTERISTICS

This abstract first appeared for US patent application 20250125293 titled 'SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL CHARACTERISTICS

Original Abstract Submitted

a semiconductor package includes a substrate including: a substrate comprising a through-hole; a first semiconductor chip in the through-hole; an adhesive layer on a side surface of the first semiconductor chip in the through-hole; a first redistribution structure on an upper surface of the substrate and bonded and connected to the substrate; a second redistribution structure on a lower surface of the substrate and bonded and connected to the substrate; a second semiconductor chip on the first redistribution structure; and a through-via spaced apart from the first semiconductor chip in a horizontal direction and passing through the substrate in a vertical direction.