SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

This abstract first appeared for US patent application 20250015063 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Original Abstract Submitted

provided is a semiconductor package including a redistribution substrate, a first semiconductor chip on the redistribution substrate, a second semiconductor chip on the redistribution substrate and spaced apart from the first semiconductor chip in a horizontal direction, a third semiconductor chip on the second semiconductor chip, and a heat dissipation chip on the first semiconductor chip and spaced apart from the third semiconductor chip in the horizontal direction, wherein the second semiconductor chip includes a plurality of through vias passing through at least a portion of the second semiconductor chip in a vertical direction, and wherein a metal pad and an adhesive layer are between the first semiconductor chip and the heat dissipation chip.