Category:Hiromasa SUO
Hiromasa SUO
Executive Summary
Hiromasa SUO is an inventor who has filed 5 patents. Their primary areas of innovation include SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds, (3 patents), NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; {METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS (1 patents), INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS (1 patents), and they have worked with companies such as Resonac Corporation (5 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).
Patent Filing Activity
Technology Areas
List of Technology Areas
- C30B29/36 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 3 patents
- C01B32/956 (NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; {METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS): 1 patents
- C01P2002/70 (INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS): 1 patents
- G01N23/2055 (INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing processes other than immunoassay, involving enzymes or microorganisms): 1 patents
- H01L21/02378 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- C30B23/063 (SINGLE-CRYSTAL GROWTH (by using ultra-high pressure, e.g. for the formation of diamonds,): 1 patents
- C30B33/00 (After-treatment of single crystals or homogeneous polycrystalline material with defined structure (): 1 patents
- H01L29/1608 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- H01L21/67288 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
- H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions): 1 patents
Companies
File:Hiromasa SUO Top Companies.png
List of Companies
- Resonac Corporation: 5 patents
Collaborators
- Kosuke Onuki (1 collaborations)
- Mitsuki TAJIMA (1 collaborations)
- Rimpei KINDAICHI (1 collaborations)