MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

Organization Name

micron technology, inc.

Inventor(s)

Glen E. Hush of Boise ID (US)

Sean S. Eilert of Penryn CA (US)

Aliasger T. Zaidy of Seattle WA (US)

Kunal R. Parekh of Boise ID (US)

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

This abstract first appeared for US patent application 20240420757 titled 'MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

Original Abstract Submitted

a memory device includes an array of memory cells configured on a die or chip and coupled to sense lines and access lines of the die or chip and a respective sense amplifier configured on the die or chip coupled to each of the sense lines. each of a plurality of subsets of the sense lines is coupled to a respective local input/output (i/o) line on the die or chip for communication of data on the die or chip and a respective transceiver associated with the respective local i/o line, the respective transceiver configured to enable communication of the data to one or more device off the die or chip.