SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA

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SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240339433 titled 'SEMICONDUCTOR DEVICE WITH A THROUGH DIELECTRIC VIA

Simplified Explanation:

This patent application discloses a semiconductor device with a through dielectric via that can provide power to the semiconductor die.

Key Features and Innovation:

Semiconductor device with through dielectric via
Dielectric material between multiple stacks of semiconductor dies
Through dielectric via extends to semiconductor die for power delivery

Potential Applications: The technology can be used in various semiconductor devices requiring efficient power delivery and connectivity.

Problems Solved: The technology addresses the need for reliable power distribution within semiconductor devices with multiple stacked dies.

Benefits:

Enhanced power delivery efficiency
Improved connectivity within semiconductor devices

Commercial Applications: Potential commercial applications include advanced electronics, IoT devices, and telecommunications equipment.

Prior Art: Prior art related to this technology can be found in patents and research papers on semiconductor device packaging and power distribution.

Frequently Updated Research: Ongoing research in semiconductor packaging and power delivery systems may provide further insights into optimizing this technology.

Questions about Semiconductor Device with Through Dielectric Via: 1. How does the through dielectric via improve power delivery in semiconductor devices? 2. What are the potential challenges in implementing through dielectric vias in semiconductor devices?

1. A relevant generic question not answered by the article, with a detailed answer: How does the through dielectric via impact the overall performance of semiconductor devices?

The through dielectric via in semiconductor devices can significantly improve power delivery efficiency and connectivity, leading to enhanced performance and reliability.

2. Another relevant generic question, with a detailed answer: What are the key considerations in designing semiconductor devices with through dielectric vias?

Design considerations for semiconductor devices with through dielectric vias include optimizing the placement of the vias, ensuring proper insulation with dielectric material, and integrating the vias seamlessly with the circuitry for efficient power distribution.

Original Abstract Submitted

a semiconductor device with a through dielectric via is disclosed. the semiconductor device assembly can include a semiconductor die and multiple stacks of semiconductor dies coupled with the semiconductor die at different lateral locations. dielectric material can be disposed at the semiconductor die between the multiple stacks of semiconductor dies. the through dielectric via can extend entirely through the dielectric material to the semiconductor die such that the through dielectric via couples with circuitry at the semiconductor die. in this way, the through dielectric via can provide power to the semiconductor die (e.g., exclusive of the multiple stacks of semiconductor dies).