Category:Yu-Bey Wu

Yu-Bey Wu

Executive Summary

Yu-Bey Wu is an inventor who has filed 7 patents. Their primary areas of innovation include ELECTRONIC MEMORY DEVICES (4 patents), Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor} (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Company, Ltd. (7 patents). Their most frequent collaborators include (4 collaborations), (4 collaborations), (4 collaborations).

Patent Filing Activity

Technology Areas

List of Technology Areas

• H10B10/125 (ELECTRONIC MEMORY DEVICES): 4 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 3 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 2 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2225/06541 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/76877 ({Thin films associated with contacts of capacitors}): 1 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 1 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L2225/06589 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1306 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L23/585 ({comprising conductive layers or plates or strips or rods or rings (): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B10/18 (ELECTRONIC MEMORY DEVICES): 1 patents

Companies

List of Companies

• Taiwan Semiconductor Manufacturing Company, Ltd.: 7 patents

Collaborators

• Jui-Lin Chen (4 collaborations)
• Feng-Ming Chang (4 collaborations)
• Ping-Wei Wang (4 collaborations)
• Tsung-Chieh Hsiao (3 collaborations)
• Ke-Gang Wen (3 collaborations)
• Liang-Wei Wang (3 collaborations)
• Yi Ling Liu (2 collaborations)
• Yun-Sheng Li (1 collaborations)
• Dian-Hau Chen (1 collaborations)
• Chih-Ching Wang (1 collaborations)