Umang Desai

Umang Desai from Portland OR US has applied for patents in technology areas such as [[:Category:Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}|Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}]] with Intel Corporation.

Patents

• RECESSED OXIDE AND SEAM-FIRST ETCH FOR AIR-GAPPED ISOLATION WALLS (20250210412)

[[Category:Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}]]