Category:Stephan Stoeckl of Schwandorf DE
Stephan Stoeckl
Stephan Stoeckl from Schwandorf DE has applied for patents in technology areas such as [[:Category:solid or gel at the normal operating temperature of the device {( takes precedence)}|solid or gel at the normal operating temperature of the device {( takes precedence)}]] with Intel Corporation.
Patents
[[Category:solid or gel at the normal operating temperature of the device {( takes precedence)}]]
Pages in category "Stephan Stoeckl of Schwandorf DE"
The following 6 pages are in this category, out of 6 total.
1
I
- Intel corporation (20250112139). VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCUITRY IN THE DIE
- Intel corporation (20250112191). DIRECT DIE-TWO-DIE CONNECTION THROUGH AN INTERPOSER WITHOUT VIAS
- Intel corporation (20250112202). THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY