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Category:Shriya Seshadri of Chandler AZ US

From WikiPatents

Shriya Seshadri

Shriya Seshadri from Chandler AZ US has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L21/56 with intel corporation.

Patents

DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (20250112162)

Pages in category "Shriya Seshadri of Chandler AZ US"

The following 3 pages are in this category, out of 3 total.

1

18375469. DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING (INTEL CORPORATION)

2

20250218953. Methods Apparatus Em (Intel)

I

Intel corporation (20250112162). DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DIE AND ASSEMBLY THEREOF ON INTEGRATED CIRCUIT PACKAGING

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