Category:Phil Geng of Washougal WA (US)
Phil Geng
Phil Geng from Washougal WA (US) has applied for patents in technology areas such as H05K5/02, H05K5/04 with intel corporation.
Patents
Pages in category "Phil Geng of Washougal WA (US)"
The following 13 pages are in this category, out of 13 total.
1
- 17957761. SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS simplified abstract (Intel Corporation)
- 18520425. COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRATED FLEXIBILITY simplified abstract (Intel Corporation)
- 18622813. DUAL IN-LINE MEMORY MODULE RETAINER simplified abstract (Intel Corporation)
- 18897955. COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES (Intel Corporation)
- 18940819. Tall DIMM Structural Retention (Intel Corporation)
- 18961017. COMPOSITE BACKPLATE ARCHITECTURES FOR BACKSIDE POWER DELIVERY AND ASSOCIATED METHODS (Intel Corporation)
I
- Intel corporation (20240113479). SOCKET INTERCONNECT STRUCTURES AND RELATED METHODS simplified abstract
- Intel corporation (20240242740). DUAL IN-LINE MEMORY MODULE RETAINER simplified abstract
- Intel corporation (20240355759). LOCALIZED DAMPING ELEMENTS FOR MITIGATING INTERCONNECT VIBRATION DAMAGE simplified abstract
- Intel corporation (20240413054). INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD DISTRIBUTION
- Intel corporation (20250071924). Tall DIMM Structural Retention
- Intel corporation (20250071938). COLD PLATE ARCHITECTURE FOR LIQUID COOLING OF DEVICES
- Intel corporation (20250089192). COMPOSITE BACKPLATE ARCHITECTURES FOR BACKSIDE POWER DELIVERY AND ASSOCIATED METHODS