Category:Min-Feng Kao of Chiayi City TW
Min-Feng Kao
Min-Feng Kao from Chiayi City TW has applied for patents in technology areas such as H01L23/48, H01L21/768, H01L23/00 with taiwan semiconductor manufacturing co., ltd..
Patents
Pages in category "Min-Feng Kao of Chiayi City TW"
The following 8 pages are in this category, out of 8 total.
1
- 18973288. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19008802. BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 19014368. SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS) (Taiwan Semiconductor Manufacturing Company, Ltd.)
2
T
- Taiwan semiconductor manufacturing co., ltd. (20250105098). OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Taiwan semiconductor manufacturing company, ltd. (20250149407). SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Taiwan semiconductor manufacturing company, ltd. (20250149509). BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES