Liang He

Liang He from Chandler AZ US has applied for patents in technology areas such as [[:Category:the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })|the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })]] with Intel Corporation.

Patents

• METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO REDUCE INTERMETALLIC COMPOUND FORMATION IN INTEGRATED CIRCUIT PACKAGES (20250201720)

[[Category:the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ takes precedence; manufacture or treatment } ; mountings per se ; {materials })]]