Category:Kristof Kuwawi Darmawikarta of Chandler AZ (US)
Kristof Kuwawi Darmawikarta
Kristof Kuwawi Darmawikarta from Chandler AZ (US) has applied for patents in technology areas such as H01L21/48, H01L23/498 with intel corporation.
Patents
Subcategories
This category has the following 2 subcategories, out of 2 total.
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Pages in category "Kristof Kuwawi Darmawikarta of Chandler AZ (US)"
The following 18 pages are in this category, out of 18 total.
1
- 17847257. PACKAGING ARCHITECTURE WITH TRENCH VIA ROUTING FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17847282. PACKAGING ARCHITECTURE WITH ROUNDED TRACES FOR ON-PACKAGE HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17847407. PACKAGING ARCHITECTURE WITH CAVITIES FOR EMBEDDED INTERCONNECT BRIDGES simplified abstract (Intel Corporation)
- 17847434. PACKAGING ARCHITECTURE WITH COAXIAL PILLARS FOR HIGH-SPEED INTERCONNECTS simplified abstract (Intel Corporation)
- 17848069. MICROELECTRONIC ASSEMBLIES WITH ANCHOR LAYER AROUND A BRIDGE DIE simplified abstract (Intel Corporation)
- 17851957. INTEGRATED CIRCUIT PACKAGES WITH SILVER AND SILICON NITRIDE MULTI-LAYER simplified abstract (Intel Corporation)
- 17937474. PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract (Intel Corporation)
- 18046635. PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract (Intel Corporation)
- 18060080. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract (Intel Corporation)
- 18187155. INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED GLASS CORES simplified abstract (Intel Corporation)
- 18343892. MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FOR HYBRID BONDING AND DIE ENCAPSULATION (Intel Corporation)
- 18945842. INTEGRATED CIRCUIT PACKAGE SUPPORTS (Intel Corporation)
I
- Intel corporation (20240105655). MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCONNECT simplified abstract
- Intel corporation (20240113049). PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES simplified abstract
- Intel corporation (20240128247). PACKAGE ARCHITECTURE WITH GLASS CORE SUBSTRATE HAVING INTEGRATED INDUCTORS simplified abstract
- Intel corporation (20240178146). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH STRENGTHENED GLASS CORES simplified abstract
- Intel corporation (20240321754). INTEGRATED CIRCUIT PACKAGES INCLUDING SUBSTRATES WITH ENCAPSULATED GLASS CORES simplified abstract
- Intel corporation (20250069902). INTEGRATED CIRCUIT PACKAGE SUPPORTS