Category:Kimin Jun of Portland OR (US)
Kimin Jun
Kimin Jun from Portland OR (US) has applied for patents in technology areas such as H01L25/065, H01L23/498, H01L25/00 with intel corporation.
Patents
Subcategories
This category has the following 3 subcategories, out of 3 total.
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O
Pages in category "Kimin Jun of Portland OR (US)"
The following 8 pages are in this category, out of 8 total.
1
- 18344260. PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING (Intel Corporation)
- 18345437. PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING (Intel Corporation)
- 18389625. INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TESTING simplified abstract (Intel Corporation)
- 18942054. MICROELECTRONIC ASSEMBLIES (Intel Corporation)
I
- Intel corporation (20240194533). INTEGRATED CIRCUIT DEVICE STRUCTURES AND DOUBLE-SIDED ELECTRICAL TESTING simplified abstract
- Intel corporation (20240355768). MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS simplified abstract
- Intel corporation (20240413237). WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS
- Intel corporation (20250070083). MICROELECTRONIC ASSEMBLIES