Category:Hsing-Chih Lin of Tainan City TW
Hsing-Chih Lin
Hsing-Chih Lin from Tainan City TW has applied for patents in technology areas such as H01L23/522, H01L23/00, H01L23/48 with taiwan semiconductor manufacturing company, ltd..
Patents
Pages in category "Hsing-Chih Lin of Tainan City TW"
The following 11 pages are in this category, out of 11 total.
1
- 18488071. INTEGRATED CIRCUIT FABRICATION EMPLOYING SELF-ALIGNED MASK (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18973288. OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19008802. BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 19014368. SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS) (Taiwan Semiconductor Manufacturing Company, Ltd.)
2
T
- Taiwan semiconductor manufacturing co., ltd. (20250105098). OVERSIZED VIA AS THROUGH-SUBSTRATE-VIA (TSV) STOP LAYER
- Taiwan semiconductor manufacturing co., ltd. (20250126812). INTEGRATED CIRCUIT FABRICATION EMPLOYING SELF-ALIGNED MASK
- Taiwan semiconductor manufacturing company, ltd. (20250014987). INTEGRATED CHIP INCLUDING THROUGH-SUBSTRATE VIA (TSV) AND LANDING STRUCTURE
- Taiwan semiconductor manufacturing company, ltd. (20250149407). SHIELD STRUCTURE FOR BACKSIDE THROUGH SUBSTRATE VIAS (TSVS)
- Taiwan semiconductor manufacturing company, ltd. (20250149509). BACKSIDE CONTACT TO IMPROVE THERMAL DISSIPATION AWAY FROM SEMICONDUCTOR DEVICES