Category:Hsin-Yen Huang of New Taipei City TW
Hsin-Yen Huang
Hsin-Yen Huang from New Taipei City TW has applied for patents in technology areas such as H01L21/768, H01L23/522, H01L23/532 with taiwan semiconductor manufacturing co., ltd..
Patents
Pages in category "Hsin-Yen Huang of New Taipei City TW"
The following 9 pages are in this category, out of 9 total.
1
- 18430150. INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUCTIVITY (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18432197. INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELECTRICALLY INSULATING STRUCTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18612386. INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARASITIC CAPACITANCE (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18990711. METAL OXIDE COMPOSITE AS ETCH STOP LAYER (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
T
- Taiwan semiconductor manufacturing co., ltd. (20250118595). INTERCONNECT STRUCTURE WITH LOW CAPACITANCE AND HIGH THERMAL CONDUCTIVITY
- Taiwan semiconductor manufacturing co., ltd. (20250125215). INTEGRATED CIRCUIT DEVICE INCLUDING A HIGH THERMAL CONDUCTIVITY ELECTRICALLY INSULATING STRUCTURE
- Taiwan semiconductor manufacturing company, ltd. (20240258166). SELECTIVE DEPOSITION FOR INTEGRATED CIRCUIT INTERCONNECT STRUCTURES
- Taiwan semiconductor manufacturing company, ltd. (20250132197). METAL OXIDE COMPOSITE AS ETCH STOP LAYER
- Taiwan semiconductor manufacturing company, ltd. (20250140605). INTERCONNECT STRUCTURE WITH HIGH THERMAL CONDUCTIVITY AND LOW PARASITIC CAPACITANCE