Category:Giridhar Nallapati of San Diego CA US
Giridhar Nallapati
Giridhar Nallapati from San Diego CA US has applied for patents in technology areas such as H01L23/532, H01L21/768, H01L23/522 with qualcomm incorporated.
Patents
Pages in category "Giridhar Nallapati of San Diego CA US"
The following 6 pages are in this category, out of 6 total.
1
Q
- Qualcomm incorporated (20250015047). SINGLE-STEP VIA-LAST PROCESS FOR MULTI-STACK WAFERS
- Qualcomm incorporated (20250096139). AIRGAPS IN TOP LAYERS OF SEMICONDUCTOR DEVICES
- Qualcomm incorporated (20250118645). INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A CAPACITOR-EMBEDDED, REDISTRIBUTION LAYER (RDL) SUBSTRATE FOR INTERFACING AN IC CHIP(S) TO A PACKAGE SUBSTRATE, AND RELATED METHODS