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Category:Colin Campbell of Darvel GB

From WikiPatents

Colin Campbell

Colin Campbell from Darvel GB has applied for patents in technology areas such as G01J1/02, G01J1/04, G01J1/16 with stmicroelectronics international n.v..

Patents

MODULE PACKAGING ARCHITECTURE TO REDUCE CROSSTALK IN AN OPTICAL SENSOR (20250109983)

Pages in category "Colin Campbell of Darvel GB"

The following 2 pages are in this category, out of 2 total.

1

18476551. MODULE PACKAGING ARCHITECTURE TO REDUCE CROSSTALK IN AN OPTICAL SENSOR (STMicroelectronics International N.V.)

S

Stmicroelectronics international n.v. (20250109983). MODULE PACKAGING ARCHITECTURE TO REDUCE CROSSTALK IN AN OPTICAL SENSOR

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