18476551. MODULE PACKAGING ARCHITECTURE TO REDUCE CROSSTALK IN AN OPTICAL SENSOR (STMicroelectronics International N.V.)
MODULE PACKAGING ARCHITECTURE TO REDUCE CROSSTALK IN AN OPTICAL SENSOR
Organization Name
STMicroelectronics International N.V.
Inventor(s)
Matteo Fissore of Edinburgh GB
MODULE PACKAGING ARCHITECTURE TO REDUCE CROSSTALK IN AN OPTICAL SENSOR
This abstract first appeared for US patent application 18476551 titled 'MODULE PACKAGING ARCHITECTURE TO REDUCE CROSSTALK IN AN OPTICAL SENSOR
Original Abstract Submitted
Various embodiments are directed to an optical sensor configured to transmit and receive optical radiation while minimizing optical noise, such as crosstalk. An example optical sensor includes an optical radiation source configured to direct optical radiation at a target object, an optical radiation receiver configured to receive reflected optical radiation off the target object, and a housing cap. The housing cap includes a transmission opening having a lower portion and an upper portion positioned to direct optical radiation toward the target object, and a receiving opening positioned to received reflected optical radiation. A first portion of the upper portion of the transmission opening includes a vertical surface that is substantially parallel to an optical transmission axis. A second portion of the upper portion of the transmission opening comprises an angled surface, progressing into the transmission opening from an outer surface of the housing cap at a transmission opening angle.