HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES

Organization Name

Inventor(s)

Mohammad Mamunur Rahman of Gilbert AZ (US)

HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18091014 titled 'HYBRID BONDED DIE-LAST INTERCONNECT ARCHITECTURES

The abstract of this patent application describes electronic packages and methods of forming them. The electronic package includes a die layer with a first side and a second side, a first die, a second die, a bridge on the first side of the die layer, and electrically conductive routing on the second side of the die layer.

Simplified Explanation:

- The patent application discusses electronic packages and their formation. - It involves a die layer with a first and second side, a first die, a second die, a bridge, and electrically conductive routing.

Key Features and Innovation:

- Electronic package design with multiple dies. - Bridge for communication between dies. - Electrically conductive routing for connectivity.

Potential Applications:

- Semiconductor industry. - Electronics manufacturing. - Integrated circuit packaging.

Problems Solved:

- Efficient communication between multiple dies. - Enhanced connectivity within electronic packages.

Benefits:

- Improved performance. - Higher integration levels. - Enhanced reliability.

Commercial Applications:

- Potential use in consumer electronics. - Industrial automation. - Telecommunications equipment.

Questions about Electronic Packages:

1. How does the bridge facilitate communication between dies? 2. What are the advantages of using electrically conductive routing in electronic packages?

Frequently Updated Research:

- Stay updated on advancements in semiconductor packaging technology for potential improvements in electronic packages.

Original Abstract Submitted

Embodiments disclosed herein include electronic packages and methods of forming electronic packages. In an embodiment, the electronic package comprises a die layer, with a first side and a second side opposite from the first side. In an embodiment, the die layer comprises a first die, and a second die. In an embodiment, a bridge is on the first side of the die layer, where the bridge communicatively couples the first die to the second die. In an embodiment, electrically conductive routing is on the second side of the die layer.