Ankit Singh

Ankit Singh from Hillsboro OR US has applied for patents in technology areas such as [[:Category:{Testing of IC packages; Test features related to IC packages (containers per se , encapsulations per se )}|{Testing of IC packages; Test features related to IC packages (containers per se , encapsulations per se )}]] with Intel Corporation.

Patents

• INTEGRATED CIRCUIT TESTING STRUCTURE FOR PAD BOND MISALIGNMENT DETECTION AND MEASUREMENT (20250216449)

[[Category:{Testing of IC packages; Test features related to IC packages (containers per se , encapsulations per se )}]]