LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

Organization Name

Intel Corporation

Inventor(s)

Robert Starkston of Phoenix AZ (US)

Debendra Mallik of Chandler AZ (US)

John S. Guzek of Chandler AZ (US)

Chia-Pin Chiu of Tempe AZ (US)

Deepak Kulkarni of Chandler AZ (US)

Ravi V. Mahajan of Chandler AZ (US)

LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

This abstract first appeared for US patent application 18818285 titled 'LOCALIZED HIGH DENSITY SUBSTRATE ROUTING

Original Abstract Submitted

Embodiments of a system and methods for localized high density substrate routing are generally described herein. In one or more embodiments an apparatus includes a medium, first and second circuitry elements, an interconnect element, and a dielectric layer. The medium can include low density routing therein. The interconnect element can be embedded in the medium, and can include a plurality of electrically conductive members therein, the electrically conductive member can be electrically coupled to the first circuitry element and the second circuitry element. The interconnect element can include high density routing therein. The dielectric layer can be over the interconnect die, the dielectric layer including the first and second circuitry elements passing therethrough.