SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER

Organization Name

Inventor(s)

SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER

This abstract first appeared for US patent application 18808869 titled 'SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER

Original Abstract Submitted

A semiconductor package includes a first semiconductor chip including a plurality of upper pads, a non-conductive support layer on a top surface of the first semiconductor chip and including a plurality of openings, a second semiconductor chip on the first semiconductor chip and including a plurality of lower pads, a plurality of chip connecting terminals extending between the plurality of upper pads and the plurality of lower pads, and an insulation adhesive layer between the first semiconductor chip and the second semiconductor chip and at least partially covering the plurality of chip connecting terminals and the non-conductive support layer. A top surface of the non-conductive support layer is disposed closer to a bottom surface of the second semiconductor chip than top surfaces of the plurality of upper pads are disposed to the bottom surface of the second semiconductor chip.