SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

This abstract first appeared for US patent application 18808787 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Original Abstract Submitted

Provided is a semiconductor package and method of manufacturing same, the semiconductor package including: a first semiconductor chip; a chip stacked structure on the first semiconductor chip, the chip stacked structure including a plurality of second semiconductor chips; a third semiconductor chip on the chip stacked structure; an adhesive layer between the chip stacked structure and the third semiconductor chip; and a first pad pattern on a lower surface of the third semiconductor chip, wherein the adhesive layer surrounds the first pad pattern and the adhesive layer is between the first pad pattern and the chip stacked structure.