18639332. MATERIAL MEASUREMENT SYSTEM AND METHOD (SAMSUNG ELECTRONICS CO., LTD.)
MATERIAL MEASUREMENT SYSTEM AND METHOD
Organization Name
Inventor(s)
Younghoon Sohn of Suwon-si (KR)
MATERIAL MEASUREMENT SYSTEM AND METHOD
This abstract first appeared for US patent application 18639332 titled 'MATERIAL MEASUREMENT SYSTEM AND METHOD
Original Abstract Submitted
A measuring system measures an overall resistance of two or more films on a substrate/measurement object by a terahertz absorption measurement and an overall film thickness by a photoacoustic measurement. The system estimates a first film thickness based on the overall resistance, then subtracts this estimated thickness from the overall film thickness measured by the photoacoustic measurement. The system includes a source unit to output a laser beam. A first pump-probe unit receives the laser beam and performs a photoacoustic test on the measurement object. A second pump-probe unit receives the laser beam and performs a terahertz signal test on the measurement object. The system also includes a stage to support the measurement object and controls for controlling elements and calculating the film thicknesses
- SAMSUNG ELECTRONICS CO., LTD.
- Sungyoon Ryu of Suwon-si (KR)
- Ingi Kim of Suwon-si (KR)
- Suhwan Park of Suwon-si (KR)
- Inkeun Baek of Suwon-si (KR)
- Younghoon Sohn of Suwon-si (KR)
- Soobin Sinn of Suwon-si (KR)
- Yusin Yang of Suwon-si (KR)
- Sunhong Jun of Suwon-si (KR)
- Ikseon Jeon of Suwon-si (KR)
- G01B11/06
- CPC G01B11/06