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18628009. PLASMA EXCITATION WITH ION ENERGY CONTROL simplified abstract (Applied Materials, Inc.)

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PLASMA EXCITATION WITH ION ENERGY CONTROL

Organization Name

Applied Materials, Inc.

Inventor(s)

Yang Yang of San Diego CA (US)

Yue Guo of Redwood City CA (US)

Kartik Ramaswamy of San Jose CA (US)

PLASMA EXCITATION WITH ION ENERGY CONTROL - A simplified explanation of the abstract

This abstract first appeared for US patent application 18628009 titled 'PLASMA EXCITATION WITH ION ENERGY CONTROL

The abstract of this patent application describes apparatus, plasma processing systems, and methods for generating a waveform for plasma processing of a substrate in a processing chamber. One embodiment includes a waveform generator with a voltage source selectively coupled to an output node, which is connected to an electrode in the processing chamber and can be selectively grounded. The waveform generator also includes a radio frequency (RF) signal generator and a filter between the RF signal generator and the output node.

  • Voltage source selectively coupled to an output node
  • Output node connected to an electrode in a processing chamber
  • Output node can be selectively grounded
  • Includes a radio frequency (RF) signal generator
  • Filter between the RF signal generator and the output node

Potential Applications: - Semiconductor manufacturing - Thin film deposition - Solar panel production - LED manufacturing

Problems Solved: - Precise control of plasma processing parameters - Enhanced substrate processing efficiency - Improved uniformity of plasma treatment

Benefits: - Increased productivity in manufacturing processes - Higher quality and consistency of processed substrates - Cost savings through optimized plasma processing

Commercial Applications: Plasma processing equipment manufacturers can integrate this technology into their systems to offer more advanced and efficient solutions to semiconductor, solar panel, and LED manufacturers.

Questions about Plasma Processing Systems: 1. How does this technology improve the efficiency of plasma processing?

  - This technology allows for precise control of plasma parameters, leading to more efficient and uniform substrate processing.

2. What are the potential cost savings associated with using this waveform generator in plasma processing systems?

  - The optimized plasma processing enabled by this technology can result in cost savings through increased productivity and improved quality of processed substrates.


Original Abstract Submitted

Embodiments provided herein generally include apparatus, plasma processing systems and methods for generation of a waveform for plasma processing of a substrate in a processing chamber. One embodiment includes a waveform generator having a voltage source selectively coupled to an output node, where the output node is configured to be coupled to an electrode disposed within a processing chamber, and where the output node is selectively coupled to a ground node. The waveform generator may also include a radio frequency (RF) signal generator, and a first filter coupled between the RF signal generator and the output node.