TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS

Organization Name

Micron Technology, Inc.

Inventor(s)

James Brian Johnson of Boise ID (US)

Brent Keeth of Boise ID (US)

Kunal R. Parekh of Boise ID (US)

Eiichi Nakano of Boise ID (US)

Amy Rae Griffin of Boise ID (US)

TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18598735 titled 'TRANSISTOR ARCHITECTURES IN COUPLED SEMICONDUCTOR SYSTEMS

The abstract describes methods, systems, and devices for transistor architectures in coupled semiconductor systems, where a memory system is formed from multiple semiconductor components that are coupled together, each implementing different techniques for transistor formation.

Memory system formed from multiple semiconductor components
Different semiconductor components implementing different transistor formation techniques
Electrical coupling between circuitry on different dies
First die includes memory array and first circuitry, second die includes second circuitry
First circuitry with transistors formed using first fabrication technique
Second circuitry with transistors formed using second fabrication technique

Potential Applications: - Memory systems in various electronic devices - High-performance computing systems - Data storage applications

Problems Solved: - Integration of different transistor technologies in a single memory system - Enhanced performance and efficiency in memory access

Benefits: - Improved memory system performance - Flexibility in designing memory systems with different transistor technologies

Commercial Applications: Title: Advanced Memory Systems for High-Performance Computing This technology can be applied in high-performance computing systems, data centers, and other memory-intensive applications. The market implications include improved processing speeds and efficiency in memory access, leading to enhanced overall system performance.

Questions about Transistor Architectures in Coupled Semiconductor Systems: 1. How do different fabrication techniques impact the performance of memory systems in coupled semiconductor components?

  - Different fabrication techniques can affect the speed, power consumption, and overall efficiency of memory systems, depending on the type of transistors formed.

2. What are the key considerations when coupling circuitry from different dies in a memory system?

  - Ensuring proper electrical coupling and compatibility between the different types of transistors is crucial for seamless operation and optimal performance.

Original Abstract Submitted

Methods, systems, and devices for transistor architectures in coupled semiconductor systems are described. A memory system may be formed from multiple semiconductor components (e.g., multiple dies, multiple wafers) that are coupled together, with different semiconductor components implementing different techniques for transistor formation. For example, a first die may include a memory array and first circuitry configured to access the memory array, and a second die coupled with the first die may include second circuitry configured to access the memory array. The first circuitry may include transistors formed in accordance with a first fabrication technique (e.g., to form a first type of transistors) and the second circuitry may include transistors formed in accordance with a second fabrication technique (e.g., to form a second type of transistors). The dies may be coupled in a manner that provides an electrical coupling between the first circuitry and the second circuitry.