18469473. BACKSIDE BI-DIRECTIONAL INTERCONNECT (QUALCOMM Incorporated)
BACKSIDE BI-DIRECTIONAL INTERCONNECT
Organization Name
Inventor(s)
Deepak Sharma of San Diego CA US
Shreesh Narasimha of Charlotte NC US
BACKSIDE BI-DIRECTIONAL INTERCONNECT
This abstract first appeared for US patent application 18469473 titled 'BACKSIDE BI-DIRECTIONAL INTERCONNECT
Original Abstract Submitted
Disclosed are techniques for a semiconductor structure. In an aspect, a semiconductor structure includes a gate stack including a first gate structure and a second gate structure offset in a first direction. The semiconductor structure includes a first source/drain (S/D) structure adjacent the first gate structure, a second S/D structure adjacent the second gate structure, a first backside conductive structure in contact with the first S/D structure, and a second backside conductive structure in contact with the second S/D structure. The semiconductor structure includes a third backside conductive structure disposed in a back portion of the semiconductor structure opposing a front portion of the semiconductor structure, extending along a second direction, and in contact with the first backside conductive structure and the second backside conductive structure.