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Create the page "H01Q21/29" on this wiki! See also the search results found.
- [[Category:H01Q21/20]] [[Category:H01Q21/29]]3 KB (454 words) - 04:15, 3 January 2024
- [[Category:H01Q21/29]]3 KB (446 words) - 02:36, 2 January 2024
- [[Category:H01Q21/29]]3 KB (497 words) - 18:22, 2 January 2024
- [[Category:H01Q21/29]]4 KB (546 words) - 10:42, 25 March 2024
- IPC Code(s): H01Q21/20, H01Q3/34 [[Category:H01Q21/20]][[Category:H01Q3/34]][[Category:NATIONAL TAIWAN UNIVERSITY]]11 KB (1,577 words) - 09:09, 19 January 2024
- [[Category:H01Q21/29]]4 KB (610 words) - 10:42, 25 March 2024
- IPC Code(s): H01F17/00, H01F27/29, H01Q5/50 ...conductor pattern face each other.[[Category:H01F17/00]][[Category:H01F27/29]][[Category:H01Q5/50]][[Category:murata manufacturing co., ltd.]]43 KB (6,462 words) - 04:36, 10 June 2024
- ...adient-index liquid crystal lens assembly, represented by IPC code [[G02F1/29]] IPC Code(s): G02F1/29, G02B27/0131 KB (4,666 words) - 08:44, 12 April 2024
- ...TD. has filed patents in the areas of [[:Category:H10K59/131|H10K59/131]] (29 applications), [[:Category:G09G3/3233|G09G3/3233]] (16 applications), [[:Ca ...ategory:G01N1/44|G01N1/44]] (2 applications), [[:Category:H01Q21/29|H01Q21/29]] (2 applications), [[:Category:C12Q1/68|C12Q1/68]] (2 applications), [[:Ca37 KB (4,509 words) - 00:28, 4 January 2024
- IPC Code(s): G02F1/29, G02B27/01, G06F3/01, G09G3/00 ...us other devices, systems, and methods are also disclosed.[[Category:G02F1/29]][[Category:G02B27/01]][[Category:G06F3/01]][[Category:G09G3/00]][[Category50 KB (7,667 words) - 07:42, 22 March 2024
- IPC Code(s): H01Q1/24, H01Q15/14, H01Q21/06 ...support an fdd mode.[[Category:H01Q1/24]][[Category:H01Q15/14]][[Category:H01Q21/06]][[Category:telefonaktiebolaget lm ericsson (publ)]]58 KB (8,526 words) - 04:59, 4 March 2024
- IPC Code(s): H01L23/498, H01L21/762, H01L23/29 ...substrate.[[Category:H01L23/498]][[Category:H01L21/762]][[Category:H01L23/29]][[Category:taiwan semiconductor manufacturing co., ltd.]]53 KB (7,713 words) - 04:09, 26 April 2024
- ...:H04W72/04|H04W72/04]] (30 applications), [[:Category:H04L5/00|H04L5/00]] (29 applications), [[:Category:H04W64/00|H04W64/00]] (20 applications), [[:Cate ...[[:Category:A61K38/08|A61K38/08]] (2 applications), [[:Category:H01Q21/24|H01Q21/24]] (2 applications), [[:Category:G16B50/00|G16B50/00]] (2 applications),36 KB (4,396 words) - 17:07, 2 January 2024
- IPC Code(s): H01Q1/40, H01Q1/24, H01Q21/06, H01Q21/20 ...[[Category:H01Q1/40]][[Category:H01Q1/24]][[Category:H01Q21/06]][[Category:H01Q21/20]][[Category:nec corporation]]73 KB (10,812 words) - 08:07, 11 April 2024
- IPC Code(s): H01L23/538, H01L23/00, H01L23/29, H01L23/31, H01L23/48, H01L25/065 ...terconnects.[[Category:H01L23/538]][[Category:H01L23/00]][[Category:H01L23/29]][[Category:H01L23/31]][[Category:H01L23/48]][[Category:H01L25/065]][[Categ65 KB (9,904 words) - 04:59, 4 March 2024
- IPC Code(s): G02C7/08, G02F1/29 ...rection to form a second focal point.[[Category:G02C7/08]][[Category:G02F1/29]][[Category:huawei technologies co., ltd.]]99 KB (15,231 words) - 07:41, 22 March 2024
- IPC Code(s): G02F1/29, G02F1/295 ...waveguide array to perform two-dimensional beam scanning.[[Category:G02F1/29]][[Category:G02F1/295]][[Category:huawei technologies co., ltd.]]108 KB (16,398 words) - 03:04, 19 March 2024
- IPC Code(s): G02B7/28, G02B27/01, G02F1/29 ...ustment region.[[Category:G02B7/28]][[Category:G02B27/01]][[Category:G02F1/29]][[Category:samsung electronics co., ltd.]]244 KB (37,693 words) - 04:25, 2 February 2024
- IPC Code(s): H01L21/683, C09J7/29, C09J7/38 ...composed by absorbing a laser beam.[[Category:H01L21/683]][[Category:C09J7/29]][[Category:C09J7/38]][[Category:samsung electronics co., ltd.]]224 KB (34,908 words) - 03:03, 19 March 2024
- IPC Code(s): H01Q15/02, H01Q1/24, H01Q21/28 ...tenna array elements.[[Category:H01Q15/02]][[Category:H01Q1/24]][[Category:H01Q21/28]][[Category:qualcomm incorporated]]168 KB (25,541 words) - 04:34, 20 February 2024