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Category:B24B37/005
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Pages in category "B24B37/005"
The following 10 pages are in this category, out of 10 total.
1
- 17870340. WAFER POLISHING APPARATUS AND METHOD OF DETECTING DEFECT OF RETAINER RING INCLUDED IN THE WAFER POLISHING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18144711. CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
- 18296021. CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING SYSTEM USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18542093. SWITCHING CONTROL ALGORITHMS ON DETECTION OF EXPOSURE OF UNDERLYING LAYER DURING POLISHING simplified abstract (Applied Materials, Inc.)