18296021. CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING SYSTEM USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING SYSTEM USING THE SAME
Organization Name
Inventor(s)
Eunkyoung Kim of Suwon-si (KR)
Boumyoung Park of Suwon-si (KR)
CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING SYSTEM USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18296021 titled 'CHEMICAL MECHANICAL POLISHING APPARATUS AND CHEMICAL MECHANICAL POLISHING SYSTEM USING THE SAME
Simplified Explanation
The patent application describes a chemical mechanical polishing apparatus with the following components:
- Supply pipes for slurry stock solution and diluent
- Flow rate control units on the supply pipes
- Mixer to mix the slurry stock solution and diluent
- Slurry storage unit to store the prepared slurry
- Slurry supply unit to supply the slurry to a polishing pad
- Control unit to control the flow rates and mixing ratio
Potential applications of this technology:
- Semiconductor manufacturing
- Optical lens polishing
- Metallography
Problems solved by this technology:
- Inconsistent polishing results
- Wastage of slurry materials
- Difficulty in controlling slurry flow rates
Benefits of this technology:
- Improved polishing precision
- Reduced material wastage
- Enhanced control over the polishing process
Original Abstract Submitted
A chemical mechanical polishing apparatus includes: supply pipes to which a slurry stock solution and a diluent are supplied; flow rate control units, respectively disposed on the supply pipes to control flow rates of the slurry stock solution and the diluent; a mixer connected to the flow rate control units and configured to mix the slurry stock solution and the diluent, supplied from the supply pipes, to prepare a slurry; a slurry storage unit connected to the mixer and configured to store the slurry prepared in the mixer; a slurry supply unit configured to draw out the slurry stored in the slurry storage unit and to supply the slurry to a polishing pad; and a control unit configured to control the flow rate control units to control a mixing ratio of the slurry stock solution and the diluent and a flow rate of the slurry to the polishing pad.
