20240042574. DUAL MEMBRANE CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING simplified abstract (Applied Materials, Inc.)

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DUAL MEMBRANE CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING

Organization Name

Applied Materials, Inc.

Inventor(s)

Steven M. Zuniga of Soquel CA (US)

Jay Gurusamy of Santa Clara CA (US)

Andrew J. Nagengast of Sunnyvale CA (US)

DUAL MEMBRANE CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240042574 titled 'DUAL MEMBRANE CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING

Simplified Explanation

The abstract describes a carrier head for chemical mechanical polishing (CMP) that consists of a base assembly and a membrane assembly. The membrane assembly includes a membrane support, an inner membrane, and an outer membrane. The inner membrane forms multiple individually pressurizable inner chambers between its upper surface and the membrane support. The outer membrane is secured to the membrane support and extends below the inner membrane, defining a lower pressurizable chamber between its inner surface and the lower surface of the inner membrane.

  • The carrier head is designed for chemical mechanical polishing (CMP) processes.
  • It includes a base assembly and a membrane assembly.
  • The membrane assembly consists of a membrane support, an inner membrane, and an outer membrane.
  • The inner membrane forms multiple individually pressurizable inner chambers between its upper surface and the membrane support.
  • The outer membrane is secured to the membrane support and extends below the inner membrane.
  • The outer membrane defines a lower pressurizable chamber between its inner surface and the lower surface of the inner membrane.
  • The inner surface of the outer membrane is positioned for contact by the lower surface of the inner membrane upon pressurization of one or more of the inner chambers.
  • The outer surface of the outer membrane is configured to contact a substrate during the CMP process.

Potential applications of this technology:

  • Chemical mechanical polishing (CMP) processes in semiconductor manufacturing.
  • Polishing and planarization of substrates in various industries, such as electronics, optics, and automotive.

Problems solved by this technology:

  • Provides a carrier head with individually pressurizable inner chambers, allowing for better control and uniformity in the polishing process.
  • The outer membrane ensures proper contact with the substrate, improving polishing efficiency and reducing defects.

Benefits of this technology:

  • Improved polishing control and uniformity.
  • Enhanced polishing efficiency and reduced defects.
  • Versatile application in various industries requiring substrate polishing and planarization.


Original Abstract Submitted

a carrier head for chemical mechanical polishing includes a base assembly and a membrane assembly connected to the base assembly. the membrane assembly includes a membrane support, an inner membrane secured to the membrane support, wherein the inner membrane forms a plurality of individually pressurizable inner chambers between an upper surface of the membrane and the membrane support, and an outer membrane secured to the membrane support and extending below the inner membrane, the outer membrane having an inner surface and an outer surface, wherein the outer membrane defines a lower pressurizable chamber between the inner surface of the outer membrane and a lower surface of the inner membrane, wherein the inner surface is positioned for contact by a lower surface of the inner membrane upon pressurization of one or more of the plurality of chambers, and wherein the outer surface is configured to contact a substrate.

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