17870340. WAFER POLISHING APPARATUS AND METHOD OF DETECTING DEFECT OF RETAINER RING INCLUDED IN THE WAFER POLISHING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
WAFER POLISHING APPARATUS AND METHOD OF DETECTING DEFECT OF RETAINER RING INCLUDED IN THE WAFER POLISHING APPARATUS
Organization Name
Inventor(s)
Jongsu Kim of Seongnam-si (KR)
Kwangsung Lee of Yongin-si (KR)
Sewon Jeon of Hwaseong-si (KR)
Youngho Jung of Hwaseong-si (KR)
WAFER POLISHING APPARATUS AND METHOD OF DETECTING DEFECT OF RETAINER RING INCLUDED IN THE WAFER POLISHING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17870340 titled 'WAFER POLISHING APPARATUS AND METHOD OF DETECTING DEFECT OF RETAINER RING INCLUDED IN THE WAFER POLISHING APPARATUS
Simplified Explanation
The patent application describes a wafer polishing apparatus that includes a base support, a polishing pad, a rotating polishing head, a polishing head support, a retainer ring, an illumination device, and a camera device.
- The polishing head is attached to the upper portion of the base support and can rotate.
- The retainer ring is attached to the lower portion of the polishing head.
- The illumination device provides light to the inner surface of the retainer ring.
- The camera device captures an image of the inner surface of the retainer ring while the polishing head rotates.
- The polishing head support can rotate on the base support, allowing the polishing head to be positioned in either a treatment region or a maintenance region of the base support.
Potential applications of this technology:
- Semiconductor manufacturing: The wafer polishing apparatus can be used in the production of semiconductor wafers to ensure precise polishing and quality control.
- Optical component manufacturing: The apparatus can also be used in the manufacturing of optical components, such as lenses or mirrors, to achieve high-quality surface finishes.
Problems solved by this technology:
- Precise monitoring: The camera device allows for real-time monitoring of the polishing process, ensuring that any defects or inconsistencies can be detected and addressed promptly.
- Efficient maintenance: The ability to rotate the polishing head support allows for easy access to the maintenance region, simplifying maintenance and reducing downtime.
Benefits of this technology:
- Improved quality control: The camera device and illumination system enable thorough inspection of the retainer ring's inner surface, ensuring that any imperfections or contaminants are identified and addressed.
- Enhanced efficiency: The rotating polishing head support and easy access to the maintenance region streamline maintenance procedures, minimizing production interruptions and maximizing productivity.
Original Abstract Submitted
A wafer polishing apparatus includes a base support; a polishing pad on the base support; a polishing head on an upper portion of the base support and configured to rotate; a polishing head support on the upper portion of the base support and connected to the polishing head, a retainer ring attached to a lower portion of the polishing head; an illumination device configured to provide light to at least a part of an inner surface of the retainer ring; and a camera device configured to capture an image of at least a part of the inner surface of the retainer ring while the polishing head rotates. The polishing head support may be configured to rotate on the base support such that the polishing head is on at least one of a treatment region or a maintenance region of the base support.
