3D Printing patent applications on January 18th, 2024

Patent Applications for 3D Printing on January 18th, 2024

Number of patent applications containing '3D Printing' or its variations: 8

20240016615. JIG FOR POST-PROCESSING OF CUSTOMIZED ORTHOPEDIC IMPLANT AND METHOD FOR MANUFACTURING SAME simplified abstract (INTER-MEDI CO., LTD.)

Organization: INTER-MEDI CO., LTD.

Inventor(s): Hyoung Gyun LIM of Gwangju (KR) for INTER-MEDI CO., LTD., Seon Shin CHO of Gwangju (KR) for INTER-MEDI CO., LTD., Ji Yeong JANG of Gwangju (KR) for INTER-MEDI CO., LTD., Su Bin KIM of Gwangju (KR) for INTER-MEDI CO., LTD.

IPC Code(s): A61F2/30, B33Y40/20, B33Y80/00, A61F2/32

20240017494. DEPOWDERING AN ELASTIC 3D PRINTED OBJECT simplified abstract (Hewlett-Packard Development Company, L.P.)

Organization: Hewlett-Packard Development Company, L.P.

Inventor(s): Edward Stanley PONOMAREV of San Diego CA (US) for Hewlett-Packard Development Company, L.P., Stephan Walter EMMENEGGER of San Diego CA (US) for Hewlett-Packard Development Company, L.P., Geoffrey SCHMID of San Diego CA (US) for Hewlett-Packard Development Company, L.P.

IPC Code(s): B29C64/35, B08B1/04, B08B5/02, B29C64/379, B08B5/04

20240017496. EXTRUSION-BASED ADDITIVE MANUFACTURING: METHOD AND 3D PRINTING SYSTEM simplified abstract (BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.)

Organization: BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.

Inventor(s): Bahri Sinan INANÇ of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V., Tom WIMMENHOVE of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V., Guus KUIPER of Enschede (NL) for BOND HIGH PERFORMANCE 3D TECHNOLOGY B.V.

IPC Code(s): B29C64/393, B29C64/182, B29C64/106

20240018305. AMORPHOUS THERMORESPONSIVE POLYMERS simplified abstract (Universiteit Gent)

Organization: Universiteit Gent

Inventor(s): Victor RETAMERO DE LA ROSA of Gent (BE) for Universiteit Gent, Richard HOOGENBOOM of AB Terneuzen (NL) for Universiteit Gent, Paul Andrew WIERINGA of JG Maastricht (NL) for Universiteit Gent, Lorenzo MORONI of RL Maastricht (NL) for Universiteit Gent

IPC Code(s): C08G73/02, A61L27/18

20240018314. Tea Fiber/PHBV/PBAT Ternary Composite and Preparation Method and Application Thereof simplified abstract (ZENCE OBJECT TECHNOLOGY (SHENZHEN) CO., LTD.)

Organization: ZENCE OBJECT TECHNOLOGY (SHENZHEN) CO., LTD.

Inventor(s): PENGJI CHEN of Shenzhen (CN) for ZENCE OBJECT TECHNOLOGY (SHENZHEN) CO., LTD.

IPC Code(s): C08J5/04, C08K5/14, C08K5/1539, C08L67/03

20240019419. MICROFLUIDIC-BASED BLADDER CANCER MIMIC AND USE THEREOF simplified abstract (CHUNG ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION)

Organization: CHUNG ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION

Inventor(s): In Ho CHANG of Seoul (KR) for CHUNG ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION, Joong Yull PARK of Seoul (KR) for CHUNG ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION, Se Young CHOI of Seoul (KR) for CHUNG ANG UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION

IPC Code(s): G01N33/50, C12N5/071, C12M3/00, B01L3/00

20240019562. AIRY BEAM-ENABLED BINARY ACOUSTIC METASURFACES FOR UNDERWATER ULTRASOUND BEAM MANIPULATION simplified abstract (Washington University)

Organization: Washington University

Inventor(s): Zhongtao Hu of St. Louis MO (US) for Washington University, Hong Chen of St. Louis MO (US) for Washington University

IPC Code(s): G01S7/524, B33Y50/00, B29C64/386

20240021774. LOW PROFILE INTERCONNECT FOR LIGHT EMITTER simplified abstract (Magic Leap, Inc.)

Organization: Magic Leap, Inc.

Inventor(s): Kevin Curtis of Boulder CO (US) for Magic Leap, Inc.

IPC Code(s): H01L33/62, G02B27/01, F21V8/00