20240021774. LOW PROFILE INTERCONNECT FOR LIGHT EMITTER simplified abstract (Magic Leap, Inc.)
Contents
LOW PROFILE INTERCONNECT FOR LIGHT EMITTER
Organization Name
Inventor(s)
Kevin Curtis of Boulder CO (US)
LOW PROFILE INTERCONNECT FOR LIGHT EMITTER - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240021774 titled 'LOW PROFILE INTERCONNECT FOR LIGHT EMITTER
Simplified Explanation
The abstract describes a patent application for an interconnect electrical that connects a light emitter to wiring on a substrate. The interconnect is deposited using 3D printing and lays flat on the light emitter and substrate. It has a rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less. This small height allows for close spacing between an overlying optical structure and the light emitter, resulting in high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.
- The interconnect electrical connects a light emitter to wiring on a substrate.
- The interconnect is deposited using 3D printing and lays flat on the light emitter and substrate.
- It has a rectangular or oval cross-sectional profile.
- The interconnect extends above the light emitter to a height of about 50 μm or less.
- The small height allows for close spacing between an overlying optical structure and the light emitter.
- This enables high efficiency in the injection of light from the light emitter into the optical structure.
Potential applications of this technology:
- Lighting systems
- Display technologies
- Optical communication devices
Problems solved by this technology:
- Efficient injection of light from a light emitter into an optical structure
- Close spacing between the light emitter and an overlying optical structure
Benefits of this technology:
- High efficiency in light injection
- Compact design
- Improved performance of lighting and display systems
Original Abstract Submitted
in some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. the interconnect may be deposited by 3d printing and lays flat on the light emitter and substrate. in some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 �m or less, or about 35 �m or less. this small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.
