SEARCH RESULTS for assignor:"PASQUALE, FRANK"

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(X0) 15201221: SELECTIVE ATOMIC LAYER DEPOSITION WITH POST-DOSE TREATMENT

(A1) 20180005814: SELECTIVE ATOMIC LAYER DEPOSITION WITH POST-DOSE TREATMENT

(B2) 1: SELECTIVE ATOMIC LAYER DEPOSITION WITH POST-DOSE TREATMENT

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(X0) 15282543: COMPOSITE DIELECTRIC INTERFACE LAYERS FOR INTERCONNECT STRUCTURES

(A1) 20180096886: COMPOSITE DIELECTRIC INTERFACE LAYERS FOR INTERCONNECT STRUCTURES

(B2) 1: COMPOSITE DIELECTRIC INTERFACE LAYERS FOR INTERCONNECT STRUCTURES

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(X0) 15268044: TEMPORALLY PULSED AND KINETICALLY MODULATED CVD DIELECTRICS FOR GAPFILL APPLICATIONS

(A1) 20180082886: TEMPORALLY PULSED AND KINETICALLY MODULATED CVD DIELECTRICS FOR GAPFILL APPLICATIONS

(B2) 1: TEMPORALLY PULSED AND KINETICALLY MODULATED CVD DIELECTRICS FOR GAPFILL APPLICATIONS

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(X0) 14798652: SYSTEMS AND METHODS FOR VAPOR DELIVERY IN A SUBSTRATE PROCESSING SYSTEM

(A1) 20160032453: SYSTEMS AND METHODS FOR VAPOR DELIVERY IN A SUBSTRATE PROCESSING SYSTEM

(B2) 9: SYSTEMS AND METHODS FOR VAPOR DELIVERY IN A SUBSTRATE PROCESSING SYSTEM

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(X0) 15431088: PLANAR SUBSTRATE EDGE CONTACT WITH OPEN VOLUME EQUALIZATION PATHWAYS AND SIDE CONTAINMENT

(A1) 20180122685: PLANAR SUBSTRATE EDGE CONTACT WITH OPEN VOLUME EQUALIZATION PATHWAYS AND SIDE CONTAINMENT

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(X0) 14805807: VALVE MANIFOLD DEADLEG ELIMINATION VIA REENTRANT FLOW PATH

(A1) 20160147234: VALVE MANIFOLD DEADLEG ELIMINATION VIA REENTRANT FLOW PATH

(B2) 9: VALVE MANIFOLD DEADLEG ELIMINATION VIA REENTRANT FLOW PATH

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(X0) 15224347: PLASMA ASSISTED ATOMIC LAYER DEPOSITION OF MULTI-LAYER FILMS FOR PATTERNING APPLICATIONS

(A1) 20160336178: PLASMA ASSISTED ATOMIC LAYER DEPOSITION OF MULTI-LAYER FILMS FOR PATTERNING APPLICATIONS

(B2) 9: PLASMA ASSISTED ATOMIC LAYER DEPOSITION OF MULTI-LAYER FILMS FOR PATTERNING APPLICATIONS