18556695. METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
- 1 METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Keiichi Nakamura of Tokyo (JP)
METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18556695 titled 'METHOD FOR MANUFACTURING SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The method described in the patent application involves immersing a substrate with circuit patterns in pure water or a corrosive solution, applying voltage to the patterns, and determining the substrate's quality based on the presence or absence of a tree-like structure forming in the patterns due to the voltage application.
- Immersing substrate in pure water or corrosive solution
- Applying voltage to circuit patterns
- Determining substrate quality based on presence of tree-like structure in patterns
Potential Applications
This technology could be applied in the manufacturing industry for quality control of substrates with circuit patterns.
Problems Solved
This method helps identify defective products early in the manufacturing process, saving time and resources.
Benefits
- Efficient quality control process - Cost-effective manufacturing - Improved product reliability
Potential Commercial Applications
"Quality Control Method for Substrate Manufacturing: Improving Product Reliability and Efficiency"
Possible Prior Art
There may be prior art related to quality control methods in substrate manufacturing, but specific examples are not provided in this patent application.
What is the impact of this technology on manufacturing processes?
This technology streamlines the quality control process in substrate manufacturing, allowing for quicker identification of defective products and enhancing overall efficiency.
How does this method compare to traditional quality control methods in the industry?
This method offers a more proactive approach to quality control by detecting defects early on in the manufacturing process, leading to cost savings and improved product reliability.
Original Abstract Submitted
A method for manufacturing a substrate according to the first disclosure includes immersing a substrate on which a plurality of circuit patterns are formed in pure water or a corrosive solution, applying voltage between the plurality of circuit patterns in a state in which the substrate is immersed in the pure water or the corrosive solution and determining the substrate to be a defective product when a tree is generated in the plurality of circuit patterns due to the voltage application and determining the substrate to be a non-defective product when the tree is not generated.
