18359096. SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
Contents
- 1 SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Mitsubishi Electric Corporation
Inventor(s)
Junichi Yamashita of Tokyo (JP)
Tomohide Terashima of Tokyo (JP)
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18359096 titled 'SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The semiconductor device described in the patent application aims to improve reliability and extend the lifespan of the device while minimizing production costs. The device includes a semiconductor element, a top electrode on the upper surface of the semiconductor element, and a conductive metal plate with copper as the main component that is solid-state diffusion bonded to the top electrode of the semiconductor element.
- Semiconductor device with improved reliability and longer life
- Top electrode on the upper surface of the semiconductor element
- Conductive metal plate with copper as the main component
- Solid-state diffusion bonding of the metal plate to the top electrode
Potential Applications
The technology described in the patent application could be applied in various semiconductor devices such as power electronics, integrated circuits, and sensors.
Problems Solved
1. Increased reliability and longer lifespan of semiconductor devices 2. Minimization of production costs
Benefits
1. Improved device performance and longevity 2. Cost-effective manufacturing process
Potential Commercial Applications
Optimizing semiconductor devices for industries such as automotive, telecommunications, and consumer electronics.
Possible Prior Art
There may be prior art related to the use of copper in semiconductor devices or solid-state diffusion bonding techniques in the semiconductor industry.
Unanswered Questions
How does the solid-state diffusion bonding process affect the overall performance of the semiconductor device?
The article does not delve into the specific impact of the solid-state diffusion bonding process on the device's performance.
Are there any limitations to the use of copper as the main component in the conductive metal plate?
The article does not address any potential limitations or drawbacks of using copper in the semiconductor device.
Original Abstract Submitted
Provided is a semiconductor device with higher reliability and longer life which can suppress an increase in production costs. A semiconductor device includes: a semiconductor element; a top electrode on an upper surface of the semiconductor element; and a conductive metal plate containing copper as a main component and solid-state diffusion bonded to the top electrode of the semiconductor element.
