US Patent Application 18448600. MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD simplified abstract

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MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD

Organization Name

ROHM CO., LTD.

Inventor(s)

Martin Wilfried Heller of Kyoto (JP)

MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18448600 titled 'MEMS SENSOR AND MEMS SENSOR MANUFACTURING METHOD

Simplified Explanation

The abstract describes a MEMS sensor that includes a semiconductor chip with a cavity, a frame portion, and a movable portion.

  • The semiconductor chip has a first and second principal surface.
  • The frame portion forms the bottom and side of the cavity.
  • The movable portion is on the first principal surface and is supported by the frame portion in a floating state.
  • The frame portion has a stepped surface between the bottom of the cavity and the first principal surface.
  • The movable portion includes a main body portion facing the cavity and an extension portion that extends towards the upper region of the stepped surface.
  • The extension portion faces the stepped surface.


Original Abstract Submitted

A MEMS sensor includes a semiconductor chip that has a first principal surface and a second principal surface and that has a cavity, a frame portion that forms a bottom portion and a side portion of the cavity, and a movable portion that is formed on the side of the first principal surface and that is supported by the frame portion in a floating state with respect to the cavity, and, in the MEMS sensor, the frame portion has a stepped surface formed at a height position between the bottom portion of the cavity and the first principal surface, and the movable portion includes a main body portion facing the cavity in a first direction and an extension portion that extends from the main body portion toward an upper region of the stepped surface in a second direction and that faces the stepped surface in the first direction.

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