US Patent Application 18447493. Apparatus and Method for Use with a Substrate Chamber simplified abstract

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Apparatus and Method for Use with a Substrate Chamber

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Li-Ting Wang of Hsinchu (TW)

Jung-Jen Chen of Hsinchu (TW)

Ming-Hua Yu of Hsinchu (TW)

Yee-Chia Yeo of Hsinchu (TW)

Apparatus and Method for Use with a Substrate Chamber - A simplified explanation of the abstract

This abstract first appeared for US patent application 18447493 titled 'Apparatus and Method for Use with a Substrate Chamber

Simplified Explanation

The patent application describes an apparatus for monitoring and controlling the growth of a wafer in an epitaxial growth chamber.

  • The apparatus includes multiple pyrometers placed at different points on the front and backside of the wafer to monitor thermal radiation.
  • A first controller adjusts the output of heating sources in different regions of the chamber based on the monitored thermal radiation from the backside of the wafer.
  • A second controller adjusts the flow rate of precursors injected into the chamber based on the monitored thermal radiation from both the front and backside of the wafer.
  • The apparatus allows for precise control of the growth process, ensuring optimal conditions for the wafer's epitaxial growth.


Original Abstract Submitted

In an embodiment, an apparatus includes a first pyrometer and a second pyrometer configured to monitor thermal radiation from a first point and a second point on a backside of a wafer, respectively, a first heating source in a first region and a second heating source in a second region of an epitaxial growth chamber, respectively, where a first controller adjusts an output of the first heating source and the second heating source based upon the monitored thermal radiation from the first point and the second point, respectively, a third pyrometer and a fourth pyrometer configured to monitor thermal radiation from a third point and a fourth point on a frontside of the wafer, respectively, where a second controller adjusts a flow rate of one or more precursors injected into the epitaxial growth chamber based upon the monitored thermal radiation from the first, second, third, and fourth points.