US Patent Application 18447443. SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING simplified abstract
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Contents
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Po-Yao Lin of Zhudong Township (TW)
Chien-Sheng Chen of Hsinchu (TW)
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING - A simplified explanation of the abstract
This abstract first appeared for US patent application 18447443 titled 'SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
Simplified Explanation
The patent application describes a method for manufacturing semiconductor devices.
- A first redistribution structure is created.
- Semiconductor devices are bonded to the first redistribution structure.
- The semiconductor devices are then encapsulated in an encapsulant.
- Openings are formed within the encapsulant, specifically along the corners, to reduce stress and prevent cracks.
Original Abstract Submitted
Semiconductor devices and methods of manufactured are presented in which a first redistribution structure is formed, semiconductor devices are bonded to the first redistribution structure, and the semiconductor devices are encapsulated in an encapsulant. First openings are formed within the encapsulant, such as along corners of the encapsulant, in order to help relieve stress and reduce cracks.
